Nowadays, the development speed of the heat sink is very fast. You can often see some CPU coolers with strange shapes and high technical content. Although the heat output of the CPU has dropped significantly, for many manufacturers, how to improve the heat dissipation efficiency and mute The effect is the most important. Ultra has introduced a semiconductor electric heating CPU cooler ChillTec, in the end how the performance let us look down.
The NP-type semiconductor is linked by a metal baffle. When the current passes through N through the electric field, the electric field causes the electrons in N and the holes in P to flow backward. The energy they generate comes from the thermal energy of the crystal lattice, so they are sucked on the baffle. Heat, exothermic at the other end to create a temperature difference.
The light is the radiator's box is not small
Fan size: 9025 (90 × 90 × 25mm)
The size of this radiator is relatively large: 128 × 104 × 147mm, equipped with a fan of 9025 (90 × 90 × 25mm), the minimum noise level is 20dBA (2000RPM), the maximum noise value is 28dBA28dBA.
Equipped with four heat pipes, all-aluminum fins and a full copper base
The radiator consists of two rows of heat sinks, each of which has two heat pipes
The radiator still adopts the active heat dissipation method, the dense fins and the four heat pipes. In order to improve the heat dissipation performance of the fan, the air hood is also provided. The minimum speed of the adjustable fan is 2000RPM and the noise is 20dBA.
● How semiconductor works
The semiconductor cooler is a cooling device composed of semiconductors, which appeared in 1960, but its theoretical basis Peltier effect can be traced back to the 19th century. The figure is a closed circuit consisting of two different metal wires, X and Y. After the power is applied, the heat of the cold end is moved to the hot end, causing the temperature of the cold end to decrease and the temperature of the hot end to rise. This is the famous Peltier. Effect. This phenomenon was first discovered in 1821 by a German scientist Thomas Seeback, but he made a wrong inference at the time and did not realize the true scientific principles behind it.
In 1834, a French watchmaker and physicist Jean Peltier, who was also a part-time researcher of this phenomenon, discovered the real reason behind this phenomenon. Until the modern era, with the development of semiconductors, it has actually applied, that is, The invention of the cooler (note that this type of refrigerator is not called a semiconductor refrigerator).
Let us look at the structure of the semiconductor refrigerator.
The particles of a plurality of N-type and P-type semiconductors are arranged one on another, and the NPs are connected by a general conductor to form a complete line, usually copper, aluminum or other metal conductor, and finally two ceramic pieces like a sandwich biscuit. When sandwiched, the ceramic sheets must be insulated and have good thermal conductivity.
Knowing so much we can already understand how semiconductors dissipate heat. Let's see how this cooling affects overclocking. <● Speed control panel is very interesting
Although a few radiators on the market are equipped with temperature control panels, this temperature control panel works much better, and the panel uses a metal wire drawing process.
The panel will display the CPU temperature, the speed of the radiator fan and the boot time. The most interesting thing is the villain on the right side. It is interesting!
Details and test scores
The base of the radiator is double-layered, with two heat pipes on each floor. If you are doubtful about this design, take a look at the bottom data!
The test uses the temperature at which the CPU is fully loaded for different fan fan speeds. From the final results, this semiconductor radiator has a good grade. However, it is important to note that such semiconductor heat sinks have water droplets on the heat sink fins during operation, which is the only drawback of semiconductor heat sinks.
● Three tips to choose (must see)
Selection of the first one: the parameters of the refrigeration sheet should pay attention to
Power: Power supply 2v ~ 15v, current consumption 3A-25A, maximum power consumption up to 120W! Be sure to use a 400W chassis power supply or another power supply to prevent burnout!
Maximum temperature difference: The maximum temperature difference between the cold side and the hot side is between 65 and 68 degrees. The maximum voltage: the maximum voltage allowed to be applied is generally 0.8 to 15.4 volts. Exceeding this voltage will not only cool but will heat up! The smaller the external dimensions, the smaller the allowable voltage and the lesser the thickness.
Cooling power: Of course, the bigger the better, the larger the size, the larger the cooling capacity, the same size, generally the thinner the thickness, the larger the cooling capacity, and the larger the corresponding current. The cooling capacity of different models is from 0.8 to 120 watts!
Selection 2: Determine the size
Most are squares from 15x15mm to 40x40mm, depending on the size of the chip. There is also a thickness problem, from 3.2 to 4.5 mm, because the cooling sheet is sandwiched between the chip and the heat sink, so how to fix it should be considered in advance.
Selection should be three: determine the cooling capacity
According to the heating power of the chip. For example, the early Pentium chip, its own power consumption of 13w, then theoretically as long as there is a cooling unit with a cooling capacity of 13w, you can absorb all the heat from the Pentium! In fact, the cooling capacity of large refrigeration chips can be as high as 40~68w! So definitely can suck the heat of the CPU, hahaha! Of course, the price is to provide it with sufficient power and a good cooling environment.
● Installation precautions (must see)
After the purchase is finished, it is necessary to install it. Since there is basically no ready-made semiconductor refrigeration equipment for the CPU, we need to fully promote the spirit of DIY to do it ourselves. Below I will introduce some key points and precautions in the production and installation process.
First, don't make mistakes in the hot and cold end, otherwise, you will wait to give your CPU a corpse, the method of distinguishing between hot and cold end is very simple, you will know when you touch it after power-on.
Second, the hot end of the semiconductor cooling must have good heat dissipation, because its cold junction temperature is determined by its hot end temperature, and the semiconductor refrigeration block has a certain normal operating temperature. If it exceeds, it will burn out. Therefore, the hot end of the semiconductor refrigeration should be equipped with a cooling fan or a water-cooled radiator.
Third, the cold end of the semiconductor refrigeration block can not directly contact the surface of the CPU, and the auxiliary heat sink should be placed in the middle, because the cold end of the semiconductor refrigeration block is generally larger than the core of the CPU, and the auxiliary heat sink is needed to remove heat from the CPU. The core conducts to the cold end of the semiconductor refrigeration, which is beneficial to make full use of the semiconductor refrigeration block.
Fourth, the semiconductor refrigeration block is preferably connected to the power supply. First, because its power is relatively large, and second, because the semiconductor refrigeration block needs to be turned on for a period of time to generate a temperature difference. If another power supply is connected, the refrigeration block can be started before starting the power. , to provide a very good low temperature environment for the CPU.
Fifth, be careful of the phenomenon of "condensation". When the cold end of the semiconductor refrigeration block is sufficiently cold, the water vapor in the air will condense on the surface to become water droplets. Friends in the north can be more assured, this phenomenon is not easy to happen in the north, friends in the south or in humid climates should pay attention, if the water drops on your motherboard or CPU, hehe, then you Don't say that I didn't remind you about it.
Sixth, the parts in contact with each part should be coated with thermal silica gel.
source：未知